USE PRIMER PLM1103275 THERMAL EXPANSION ACCOMMODATION OF THE BONDED SURFACES. • ONE COMPONENT, READY TO USE. • FOR BONDING POROUS SUBSTRATES TO THEMSELVES, SUCH AS FIBERGLASS, METAL, PLASTIC LAMINATE, PLATES MADE OF MELAMINE, EPOXY SUBSTRATES, USE IN COMBINATION WITH MS BOOSTER F IN MAXIMUM PROPORTION OF 2% APPLICATION TEMPERATURE +5°C TO +35°C SKIN FORMATION TIME 40’APPROX(20°C/50%R.H.) CURING SPEED 2-3MM/24H.(20°C/50%R.H.)
Brand | Polymar |
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Brand: Polymar |